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Редактировать с помощью David Hodson -

Правка одобрена автор David Hodson

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[* black] We're used to the innards of devices being dominated by a single component, but those space hogs are usually batteries or power supplies. Over a third of the real estate in the Co-Star is inhabited by the aluminum heat sink.
[* black] Why put such a huge heat sink inside a device so small? Well, without fans to provide moving air for forced convection[http://www.engineeringtoolbox.com/convective-heat-transfer-d_430.html|convection], the Co-Star relies on conduction[http://www.engineeringtoolbox.com/conductive-heat-transfer-d_428.html|conduction] and natural convection to keep the processor cool.
[* black] Why put such a huge heat sink inside a device so small? Well, without fans to provide moving air for forced convection[http://www.engineeringtoolbox.com/convective-heat-transfer-d_430.html|convection], the Co-Star relies on conduction[http://www.engineeringtoolbox.com/conductive-heat-transfer-d_428.html|conduction] and natural convection to keep the processor cool.