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Правка одобрена автор Eric Flores

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[* black] We're used to the innards of devices being dominated by a single component, but those space hogs are usually [guide|9623|batteries|stepid=36530] or [guide|3625|power supplies|stepid=17316].
[* black] Over a third of the real estate in the Co-Star is inhabited by the aluminum heat sink.
[* blackicon_note] Why put such a huge heat sink inside a device so small? Well, without fans to provide moving air for forced [http://www.engineeringtoolbox.com/convective-heat-transfer-d_430.html|convection], the Co-Star relies on [http://www.engineeringtoolbox.com/conductive-heat-transfer-d_428.html|conduction] and natural convection to keep the processor cool.
[* blackicon_note] Why put such a huge heat sink inside a device so small? Well, without fans to provide moving air for forced [http://www.engineeringtoolbox.com/convective-heat-transfer-d_430.html|convection], the Co-Star relies on [http://www.engineeringtoolbox.com/conductive-heat-transfer-d_428.html|conduction] and natural convection to keep the processor cool.