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Edit by David Hodson

Правка одобрена автор David Hodson

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[* black] A member of the Chipworks development team sets up parameters on the IBE for the removal of the dielectrics on an advanced node chip (like the A6) where wethere may havebe up to 9 Coppercopper and 1 Aluminumaluminum layer plus polysilicon and substrate layers.
[* black] RecentlyRecently, Chipworks completed an addition to their delayering lab, adding several more wet benches, fume hoods, and polishing stations
[* black] A member of the Chipworks development team sets up parameters on the IBE for the removal of the dielectrics on an advanced node chip (like the A6) where wethere may havebe up to 9 Coppercopper and 1 Aluminumaluminum layer plus polysilicon and substrate layers.
[* black] RecentlyRecently, Chipworks completed an addition to their delayering lab, adding several more wet benches, fume hoods, and polishing stations