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[* black] Next to come out are the fan and heat sink.
[* black] Nintendo designers [http://iwataasks.nintendo.com/interviews/#/wiiu/console/0/1|explained] that the larger fan and heat sink were necessary to handle the nearly tripled heat output from the new ICs. They must agree that [http://bit.ly/dxDnFZ|fried chips] go better with sandwiches than game consoles.
[* black] With the heat sink off, we get closer to the CPU and GPU, called the Wii U's multi[http://en.wikipedia.org/wiki/Multi-chip_module|multi chip modulemodule] (MCM), still hidden beneath a thermal pad.
[* black] Nintendo designers [http://iwataasks.nintendo.com/interviews/#/wiiu/console/0/1|explained] that the larger fan and heat sink were necessary to handle the nearly tripled heat output from the new ICs. They must agree that [http://bit.ly/dxDnFZ|fried chips] go better with sandwiches than game consoles.
[* black] With the heat sink off, we get closer to the CPU and GPU, called the Wii U's multi[http://en.wikipedia.org/wiki/Multi-chip_module|multi chip modulemodule] (MCM), still hidden beneath a thermal pad.
[* black] Thanks to the upgraded AMD GPU, the Wii U boasts HD graphics up to 1080p.
[* black] Nintendo has [[Topic:Nintendo Game Console|come a long way]] over the years considering that wiiwe remember when Mario had fewer bits than our [product|IF145-028|26-bit driver kit].
[* black] Nintendo has [[Topic:Nintendo Game Console|come a long way]] over the years considering that wiiwe remember when Mario had fewer bits than our [product|IF145-028|26-bit driver kit].