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Правка отклонена автор Sam Goldheart

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Шаг Линий

[* black] It's time to think inside the box. The prominent ICs found on the frontside of the motherboard:
[* red] [link|http://en.wikipedia.org/wiki/GlobalFoundries|GlobalFoundries|new_window=true] (joint venture of AMD and ATIC) [link|http://en.wikipedia.org/wiki/Xenon_(processor)|XCGPU|new_window=true] SoC (combination of the Xenon CPU and the Xenos X818337 GPU onto the same die, with eDRAM in the same package)
[* orange] Microsoft X850744-004 south bridge
[* yellow] Hynix [http://www.hynix.com/datasheet/pdf/flash/HY27US(08_16)281A%20Series(Rev0.6).pdf|HY27US08281A|new_window=true] 128 Mb NAND flash
[* green] Samsung [http://www.samsung.com/us/business/oem-solutions/onlinetool/graphics_ddr_sdram.html|K4J10324KG-HC14|new_window=true] 1 GbGib GDDR3 SDRAM (total of fourfour; 1 Gib * 4 = 4 GbGib = 512 MBMiB)
[* green] Samsung [http://www.samsung.com/us/business/oem-solutions/onlinetool/graphics_ddr_sdram.html|K4J10324KG-HC14|new_window=true] 1 GbGib GDDR3 SDRAM (total of fourfour; 1 Gib * 4 = 4 GbGib = 512 MBMiB)
[* black] On the backside...
[* black] A green land flecked with gold and the hopes of the [http://www.youtube.com/watch?v=BiUzaqOU06M|internet-free gamers|new_window=true] of tomorrow.