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Редактировать с помощью Lauren Murphy -

Правка одобрена автор Adam O'Camb

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Шаг Линий

[* black] 'The south bridge is located in the red square in the picture.
[* black] The chipset is located in the blue square in the picture. The chipset combines the north bridge and the Intel GMA 950 into one die.
[* black] The heat sink uses thermal paste and pads.
[* black] The thermal pad inis located in the green square in the picture.
[* black] The thermal pad inis located in the green square in the picture.
[* black] The thermal paste is located in the red square in the picture.