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| [title] How to dissect a processor |
| [* black] Back when the original iPhone came out, we worked with some friends of ours in Silicon Valley to dissect the processor. The equipment we used wasn't nearly as cutting-edge as what Chipworks uses, but it got the job done. |
| [* black] This is a silicon wafer. Each small square is a chip, called a die. The processor die in the A4 is 7.3 mm on each side, for a 53 square mm total area. The percent of working dies that you can get from a wafer like this is called the '''yield.''' |
| [* black] This is a silicon wafer. Each small square is a chip, called a die. The processor die in the A4 is 7.3 mm on each side, for a 53 square mm total area. The percent of working dies that you can get from a wafer like this is called the '''yield.''' |
| [* black] The A4 is actually much more than just a processor— it's a Package on Package, or PoP. In fact, there are three silicon dies inside the A4! |