Перейти к основному содержанию

Changes to Step #6

Edit by Miroslav Djuric

На одобрении

Удален
Добавлено
Без изменений

Шаг Линий

[* black] So what is a package? You're looking at one.
[* black] This is a cross-section of the iPhone's ARM processor + RAM package. [http://www.ifixit.com/Misc/iphone_processor_crossection.jpg|Click here to see it in its full, 2854x313 glory.]
[* black] This is the side of a processor + RAM package. The processor itself is the center rectangle. The silver circles underneath it are solder balls.
[* black] This is a cross-section of the iPhone's ARM processor + RAM package. [http://www.ifixit.com/Misc/iphone_processor_crossection.jpg|Click here to see it in its full, 2854x313 glory.]
[* black] This is the side of a processor + RAM package. The processor itself is the center rectangle. The silver circles underneath it are solder balls.
[* black] The two rectangles above the processor are RAM dies.They are offset from each other to make room for the wirebonds, which you can't see in this shot.
[* black] Having the RAM so close to the processor both reduces latency—making RAM access faster—and cuts power consumption, helping your battery last longer.