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The shields are down! A quick pass with a heat gun and we get our first look at the CPU and GPU, both covered in ample thermal compound. GPU: AMD Radeon™-based High Definition GPU.
  • The shields are down! A quick pass with a heat gun and we get our first look at the CPU and GPU, both covered in ample thermal compound.

  • GPU: AMD Radeon™-based High Definition GPU.

  • CPU: IBM Power®-based multi-core processor.

  • We believe Nintendo placed these ICs close to one another to reduce latency and power consumption.

继续回到主板上,我们用热风枪来加热、移除CPU/GPU整合芯片上方的顶盖。上面都覆盖了充足的导热硅脂。

GPU: 基于AMD Radeon™的高清GPU

CPU: 基于IBM Power®的多核处理器

可以看出任天堂通过将芯片设计为整合方式来减少功耗和彼此的干扰。

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