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Repeat the heating and cutting procedure for the remaining three sides of the phone. Leave an opening pick under each edge to prevent the adhesive from resealing. Leave an opening pick under each edge to prevent the adhesive from resealing.
  • Repeat the heating and cutting procedure for the remaining three sides of the phone.

  • Leave an opening pick under each edge to prevent the adhesive from resealing.

Repite el paso previo de calentado y corte del adhesivo en los tres bordes restantes.

Deja una púa de apertura en cada borde del dispositivo mientras continúas para evitar que se vuelva a unir con el adhesivo.

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