First audio ic attempt goes bad...!

Ok thanks .. i read about this issue , and it seems caused by pulling the chip while pads are not totally melted.. is this correct?.. maybe it needed more heat or time

@denv You're right, a combination of low temperature and pull force. Pads are very thin, little more than a hair and although they're virtually part of the board they are very fragile. I'd suggest touching the IC sideways a little bit to make sure solder is fully melted before lifting the IC. But it's just a personal approach, each of us develops his/her own feel for it, practice is very important.

Do I have to pratice with iPhone ICs or I can try also with other phones? I have older models like 2000s Motorola, or more recents like Nokia Lumia.. and also a little advice with temperature and time? I know everyone uses different, but I'm curious....

@denv Ambient and board temperatures can make a difference, as well as the size of nozzle used and Pcb holder. Personally with BGA on iPhones I prefer to work around 350C. when dealing with lead free solder and around 320C. with leaded. A thermocouple might help you verifying temperatures. Some work with lower, others with higher temperatures though. I don't like using a preheater, others seem to love it. As for practice boards, anything will do to start with, but when you get some feel and confidence I would recommend to shift to the boards you are inclined to work on.