Yep, there two ways that I use to shield surrounding components of what you are heating up.
- Apply Kapton (Yellow non-conductive) tape to surrounding components
- Use thick metal objects that absorb heat well like a penny / coin (if needed)
Pre-heating the board to something like 80°C will make it easier to remove the component being heated.
Avoid using a small nozzle as they are prone to blowing surrounding components away for the heat gun and don’t heat components for too long when putting them on to the board.
For a lot of my re-work I use 380-480°C depending on the heat required, this will vary between hot air stations so might want to practice removing and putting back SMD components / BGA components on dead boards first.
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