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Введение

Follow this guide to replace the heat shield plate in a Nintendo Switch gaming console.

  1. Remove the four 6.3 mm Tri-point Y00 screws from the rear panel.
    • Remove the four 6.3 mm Tri-point Y00 screws from the rear panel.

  2. Remove the single 6.1 mm Phillips #000 screw from underneath the kickstand.
    • Remove the single 6.1 mm Phillips #000 screw from underneath the kickstand.

  3. Remove the two 2.7 mm Phillips #000 screws from the bottom of the device.
    • Remove the two 2.7 mm Phillips #000 screws from the bottom of the device.

  4. Remove the single 2.7 mm Phillips #000 screw from the top of the device.
    • Remove the single 2.7 mm Phillips #000 screw from the top of the device.

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  6. Remove the single 3.8 mm Phillips #000 screw from the right Joy-Con rail. Remove the single 3.8 mm Phillips #000 screw from the left Joy-Con rail.
    • Remove the single 3.8 mm Phillips #000 screw from the right Joy-Con rail.

    • Remove the single 3.8 mm Phillips #000 screw from the left Joy-Con rail.

  7. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device. Pull the rear panel up and off of the device.
    • Pull the rear panel up and off of the device.

  8. Remove the single 3.1 mm Phillips screw from micro SD card board.
    • Remove the single 3.1 mm Phillips screw from micro SD card board.

  9. Gently lift the micro SD card board straight up, away from the Switch to disconnect and remove it. During reassembly, line up the micro SD card board and lightly press on the foam pad until the press connector snaps into place to reconnect it.
    • Gently lift the micro SD card board straight up, away from the Switch to disconnect and remove it.

    • During reassembly, line up the micro SD card board and lightly press on the foam pad until the press connector snaps into place to reconnect it.

  10. Remove the six 3.1mm Phillips #000 screws from the shield plate.
    • Remove the six 3.1mm Phillips #000 screws from the shield plate.

  11. Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.
    • Remove the shield plate from the device.

    • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

Заключение

To reassemble your device, follow these instructions in reverse order.

5 участников успешно повторили данное руководство.

Blake Klein

Участник с: 29.01.2017

53 583 Репутация

Автор 49 руководств

Комментариев: 2

Hey - I think you’re missing a step, how do you remove the SD card reader?

Terra Field - Ответить

Great catch! The guide has been updated, thanks!

Blake Klein -

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