Возврат к шагу #3
Отредактированно Alex Diaz-Kokaisl -
Правка одобрена автор Alex Diaz-Kokaisl
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| [title] Remove the heat sink | |
| [* black] Use your fingers to lift the logic board up and off of the heat sink. | |
| [* icon_note] You may feel a bit of resistance. This is normal, since [link|https://guide-images.cdn.ifixit.com/igi/pbdKFvx1IMVyZY3n.full|the heat sink is slightly bonded to the logic board with thermal paste|new_window=true]. | |
| [* black] Remove the heat sink. | |
| + | [* icon_reminder] A thick, grey thermal compound bridges the gap between the logic board and the heat sink underneath. Whenever the heat sink is removed, refer to our [guide|744|thermal paste guide|new_window=true] to remove the old thermal compound and replace it with an appropriate compound, such as [product|IF179-010-2|Artic Silver Thermal Paste|new_window=true], during reassembly. |